01
ʻO ka hoʻohana ʻana i nā kaula lipine
Me ka hoʻomohala wikiwiki ʻana o nā huahana uila, ke hoʻonui wikiwiki nei ka noi ʻana i nā kaula lipine.Loaʻa i nā mea uila a pau āu e ʻohi ai i kēia lā i nā kaula lipine.He palupalu, lahilahi, a maʻalahi ka haki ʻana o ke kaula lipine.Kūlike nā kūlana ana.Hoʻolālā kūʻokoʻa a hana ʻia ka mīkini ana ʻike e Sinowon i ka ʻike ʻana i ka nui o ka mokulele ʻelua, me ka hana maʻalahi a me ka hoʻomaikaʻi ʻana i ka hana hana.
02
Ka Hoohana O Pcb, Nameplate, Pai, Touchpanel, Glass Mesh Plate, Chip, and Steel Mesh.
No ka PCB, ka papa inoa, ka paʻi ʻana, TouchPanel, ka pā aniani mesh, chip, a me ke kila mesh, hiki i ka mīkini ana ʻike ke ana i nā ana o waho, kūlana, a me ka laulā laina.
No ka pale siliki mesh pā, TouchPanel / aniani, hiki i ka mea kani ke ana i nā ana o waho, palahalaha, mānoanoa, curvature, a me ka nui o ka lua.
03
Ka Hoohana O Gear
Hiki ke hoʻohana ʻia nā mīkini ana ʻike no ke ana ʻana i ka pōʻai addendum gear, pōʻai dedendum, pitch, deviation profile deviation, helix deviation, radial runout, shaving cutter, a me hobbing cutter profile deviation.
04
Palaki a me ka Rubber
Me nā mea uila, ʻoihana kaʻa, aerospace, nā huahana lāʻau lapaʻau, nā kemika o kēlā me kēia lā, mea kani, uea a me ke kaula, nā mea hana hale a me nā huahana ʻē aʻe e hana ana a me nā huahana ʻē aʻe.
05
Make ʻOki
Me ke kaula kiaʻi, ke kiʻi ʻoniʻoni pale pale, ka pā paʻi, ka pale hōʻike, ka papa kaapuni, nā ʻāpana backlight, ka kānana lepo, ka pākaukau pākaukau, ka papa inoa a me nā ʻāpana papa palupalu ʻē aʻe, etc.
06
Hoʻopaʻa ʻana
Me nā ʻāpana uila, shrapnel, nā punawai, nā ʻāpana kelepona paʻa, nā mea pono pahu kiaʻi, nā mea e pono ai i kēlā me kēia lā, nā ʻāpana kaʻa, etc.
07
3C (Kamepiula, Hoʻokaʻaʻike, Mea Uila Mea Hoʻohana)
Me nā uhi aniani, nā ʻāpana ʻokoʻa, nā chips, nā papa kaapuni, nā pale hoʻopā, a me nā mea ʻē aʻe o nā kelepona paʻa, IPAD a me nā huahana uila ʻē aʻe, a me nā mea pono peripheral.
08
ʻoihana mold
Hoʻopili i nā huahana mold, ʻāpana ʻāpana, hoʻokomo ʻia, nā kumu hoʻoheheʻe, nā kumu hoʻoheheʻe, nā cores mold, etc.
09
Semiconductor
Me nā wafers, mua-hope, hope-hope, ʻāpana, papa, pūʻolo, etc.
10
ʻOihana Hoʻoponopono Pono Lako
Me nā ʻāpana hāmeʻa, make-casting, screws, springs, profiles, gears and other mechanical processing, powder metallurgy injection molding.
11
ʻOihana IT
Me nā mea hoʻohui, nā hopena, nā ʻāpana, nā hoʻololi, nā lako kaapuni, nā kaʻa i hoʻohui ʻia, nā uea a me nā kaula, nā ʻāpana uila, etc.